검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Effects of homogenous loading on silicon direct bonding Huang LY, Ho KL, Hu CT Applied Surface Science, 257(17), 7693, 2011 |
| 2 |
Influence of microwave annealing on direct bonded silicon wafers Alford TL, Tang T, Thompson DC, Bhagat S, Mayer JW Thin Solid Films, 516(8), 2158, 2008 |
| 3 |
Improved characterization methods for unipolar directly bonded semiconductor junctions Stuchinsky VA, Kamaev GN, Khoroshilov KY Solid-State Electronics, 49(1), 9, 2005 |
| 4 |
선형열처리법으로 직접 접합된 Si 기판 및 산화된 Si 기판의 접합 특성 이진우, 강춘식, 송오성, 류지호 Korean Journal of Materials Research, 10(10), 665, 2000 |