검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Sn-40Pb/Cu 및 Sn-3.0Ag-0.5Cu/Cu 접합부 계면반응 및 활성화에너지 김휘성, 홍원식, 박성훈, 김광 Korean Journal of Materials Research, 17(8), 402, 2007 |
| 2 |
Nano-indentation characterization of Ni-Cu-SnIMC layer subject to isothermal aging Xu LH, Pang JHL Thin Solid Films, 504(1-2), 362, 2006 |
| 3 |
Interfacial microstructures and kinetics of Au/SnAgCu Lee TK, Zhang S, Wong CC, Tan AC, Hadikusuma D Thin Solid Films, 504(1-2), 441, 2006 |
| 4 |
SnAgCu계 무연솔더의 전기화학적 반응에 따른 타펠 특성 홍원식, 김광배 Korean Journal of Materials Research, 15(8), 536, 2005 |