검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Characterization of reflow soldering at a peak temperature of 215 degrees C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball Hwang JH, Lee JH Applied Surface Science, 454, 227, 2018 |
| 2 |
Thermal diffusivity of Sn-Ag-Cu-based, Pb-free, micro- and nano-sized solder balls Kim I, Kang MI, Kim SW, Jung E, Lee SH Thermochimica Acta, 542, 42, 2012 |
| 3 |
Impact reliability estimation of lead free solder joint with IMC layer Kim JM, Woo SW, Chang YS, Kim YJ, Choi JB, Ji KY Thin Solid Films, 517(14), 4255, 2009 |
| 4 |
Sn-4.0wt%Ag-0.5wt%Cu 솔더 접합계면의 강도특성과 미세파괴거동에 대한 In-situ관찰 이경근, 최은근, 추용호, 김진수, 이병수, 안행근 Korean Journal of Materials Research, 18(1), 38, 2008 |
| 5 |
Interfacial reaction between Sn-Ag based solders and Au/Ni alloy platings Uenishi K, Kobayashi KF Materials Science Forum, 502, 411, 2005 |