| 1 |
Investigation and analysis of thermo-mechanical degradation of fingers in a photovoltaic module under thermal cyclic stress conditions
Kumar S, Gupta R
Solar Energy, 174, 1044, 2018 |
| 2 |
Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates
Ogbomo OO, Amalu EH, Ekere NN, Olagbegi PO
Solar Energy, 170, 682, 2018 |
| 3 |
Properties and microstructures of SnAgCu-xEu alloys for concentrator silicon solar cells solder layer
Zhang L, Han JG, Guo YH, Sun L
Solar Energy Materials and Solar Cells, 130, 397, 2014 |
| 4 |
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell
Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N
Journal of Applied Electrochemistry, 41(4), 469, 2011 |
| 5 |
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface
Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N
Journal of Applied Electrochemistry, 38(12), 1695, 2008 |
