| 1 |
Elevated and cryogenic temperature micropillar compression of magnesium-niobium multilayer films
Thomas K, Mohanty G, Wehrs J, Taylor AA, Pathak S, Casari D, Schwiedrzik J, Mara N, Spolenak R, Michler J
Journal of Materials Science, 54(15), 10884, 2019 |
| 2 |
Monitoring of stress-strain evolution in thin films by reflection anisotropy spectroscopy and synchrotron X-ray diffraction
Wyss A, Sologubenko AS, Mishra N, Gruber PA, Spolenak R
Journal of Materials Science, 52(11), 6741, 2017 |
| 3 |
Microstructure and mechanical properties of metastable solid solution copper-tungsten films
Thomas K, Taylor AA, Raghavan R, Chawla V, Spolenak R, Michler J
Thin Solid Films, 642, 82, 2017 |
| 4 |
Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition
Hirt L, Ihle S, Pan ZJ, Dorwling-Carter L, Reiser A, Wheeler JM, Spolenak R, Voros J, Zambelli T
Advanced Materials, 28(12), 2311, 2016 |
| 5 |
An in situ X-ray diffraction study of phase separation in Cu-Ta alloy thin films
Muller CM, Spolenak R
Thin Solid Films, 598, 276, 2016 |
| 6 |
The Hidden Pathways in Dense Energy Materials - Oxygen at Defects in Nanocrystalline Metals
Scherrer B, Dobeli M, Felfer P, Spolenak R, Cairney J, Galinski H
Advanced Materials, 27(40), 6220, 2015 |
| 7 |
Magnetron sputter deposited tantalum and tantalum nitride thin films: An analysis of phase, hardness and composition
Bernoulli D, Muller U, Schwarzenberger M, Hauert R, Spolenak R
Thin Solid Films, 548, 157, 2013 |
| 8 |
Influence of the brazing parameters on microstructure, residual stresses and shear strength of diamond-metal joints
Buhl S, Leinenbach C, Spolenak R, Wegener K
Journal of Materials Science, 45(16), 4358, 2010 |
| 9 |
A combinatorial study on the influence of Cu addition, film thickness and heat treatment on phase composition, texture and mechanical properties of Ti-Ni shape memory alloy thin films
Borgia C, Olliges S, Dietiker M, Pigozzi G, Spolenak R
Thin Solid Films, 518(8), 1897, 2010 |
| 10 |
Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approach
Eberl C, Spolenak R, Kraft O, Ruile W, Arzt E
Thin Solid Films, 515(6), 3291, 2007 |
