| 1 |
A-site deficiency, phase purity and crystal structure in lanthanum strontium ferrite powders
Striker T, Ruud JA, Gao Y, Heward WJ, Steinbruchel C
Solid State Ionics, 178(21-22), 1326, 2007 |
| 2 |
Plasma etching of benzocyclobutene in CF4/O-2 and SF6/O-2 plasmas
Kim GS, Steinbruchel C
Journal of Vacuum Science & Technology A, 24(3), 424, 2006 |
| 3 |
TiN, TaN and WxN as diffusion barriers for Cu on SiO2: capacitance-voltage, leakage current, and triangular-voltage-sweep tests after bias temperature stress
Kizil H, Steinbruchel C
Thin Solid Films, 449(1-2), 158, 2004 |
| 4 |
Nucleation and growth of electrochemically deposited copper on TiN and copper from a Cu-NH3 bath
Graham L, Steinbruchel C, Duquette DJ
Journal of the Electrochemical Society, 149(8), C390, 2002 |
| 5 |
Analysis of Langmuir probe data: Analytical parametrization, and the importance of the end effect
Narasimhan G, Steinbruchel C
Journal of Vacuum Science & Technology A, 19(1), 376, 2001 |
| 6 |
Electrical behavior of Cu thin fluorinated PECVD oxide MIS capacitors
Mallikarjunan A, Murarka SP, Steinbruchel C, Kumar A, Bakhru H
Journal of the Electrochemical Society, 147(9), 3502, 2000 |
| 7 |
Parametrization of Laframboise's results for spherical and cylindrical Langmuir probes
Karamcheti A, Steinbruchel C
Journal of Vacuum Science & Technology A, 17(5), 3051, 1999 |
| 8 |
Nondestructive, Interferometric Method for Measuring the Thickness of a Silicon Membrane
Adee JM, Steinbruchel C
Thin Solid Films, 306(1), 171, 1997 |
| 9 |
Fine-Line Patterning of Parylene-N by Reactive Ion Etching for Application as an Interlayer Dielectric
Tacito RD, Steinbruchel C
Journal of the Electrochemical Society, 143(6), 1974, 1996 |
| 10 |
Patterning of Benzocyclobutene by Reactive Ion Etching
Tacito RD, Steinbruchel C
Journal of the Electrochemical Society, 143(8), 2695, 1996 |
