검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Competition between dislocation nucleation and void formation as the stress relaxation mechanism in passivated Cu interconnects Zhang J, Zhang JY, Liu G, Zhao Y, Sun J Thin Solid Films, 517(9), 2936, 2009 |
| No. | Article |
|---|---|
| 1 |
Competition between dislocation nucleation and void formation as the stress relaxation mechanism in passivated Cu interconnects Zhang J, Zhang JY, Liu G, Zhao Y, Sun J Thin Solid Films, 517(9), 2936, 2009 |