| 1 |
The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
Liao CH, Zhang ST, Chen SJ, Qiang YJ, Liu G, Tang MX, Tan BC, Fu DL, Xu Y
Journal of Electroanalytical Chemistry, 827, 151, 2018 |
| 2 |
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정
김회철, 김재정
Korean Chemical Engineering Research, 54(6), 723, 2016 |
| 3 |
Pulsed electrodeposition of CuSCN for superfilling of ZnO nanowire array electrodes
Gertman R, Berger Y, Visoly-Fisher I
Electrochimica Acta, 125, 65, 2014 |
| 4 |
Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer
Kim MJ, Choe S, Kim HC, Lee SJ, Kim SH, Kwon OJ, Kim JJ
Electrochimica Acta, 147, 371, 2014 |
| 5 |
반도체 소자용 구리 배선 형성을 위한 전해 도금
김명준, 김재정
Korean Chemical Engineering Research, 52(1), 26, 2014 |
| 6 |
Three-dimensional assembly and electrical properties of Cu2O/ZnO heterojunction via an electrochemical superfilling method
Li M, Wu WB, Liu KF, Hu GD, Xu HY
Electrochimica Acta, 71, 100, 2012 |
| 7 |
Inverse analysis of accelerator distribution in copper through silicon via filling
Matsuoka T, Otsubo K, Onishi Y, Amaya K, Hayase M
Electrochimica Acta, 82, 356, 2012 |
| 8 |
Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Luhn O, Van Hoof C, Ruythooren W, Celis JP
Electrochimica Acta, 54(9), 2504, 2009 |
| 9 |
Effect of the molecular weight of polyethylene glycol as single additive in copper deposition for interconnect metallization
Ko SL, Lin JY, Wang YY, Wan CC
Thin Solid Films, 516(15), 5046, 2008 |
| 10 |
Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution
Wu BH, Wan CC, Wang YY
Journal of Applied Electrochemistry, 33(9), 823, 2003 |
