화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Electrochemical investigation of the roles of oxyanions in chemical-mechanical planarization of tantalum and tantalum nitride
Sulyma CM, Pettit CM, Surisetty CVVS, Babu SV, Roy D
Journal of Applied Electrochemistry, 41(5), 561, 2011
2 Utility of Oxy-Anions for Selective Low Pressure Polishing of Cu and Ta in Chemical Mechanical Planarization
Surisetty CVVS, Peethala BC, Roy D, Babu SV
Electrochemical and Solid State Letters, 13(7), H244, 2010
3 Oxalic-acid-based slurries with tunable selectivity for copper and tantalum removal in CMP
Janjam SVSB, Surisetty CVVS, Pandija S, Roy D, Babu SV
Electrochemical and Solid State Letters, 11(3), H66, 2008
4 Dissolution Inhibition in Cu-CMP Using Dodecyl-Benzene-Sulfonic Acid Surfactant with Oxalic Acid and Glycine as Complexing Agents
Surisetty CVVS, Goonetilleke PC, Roy D, Babu SV
Journal of the Electrochemical Society, 155(12), H971, 2008