| 1 |
Investigation of the hydrogen induced cracking behaviour of API 5L X65 pipeline steel
Jack TA, Pourazizi R, Ohaeri E, Szpunar J, Zhang JM, Qu JB
International Journal of Hydrogen Energy, 45(35), 17671, 2020 |
| 2 |
Conversion of Imidazole to N-(3-Aminopropyl)imidazole toward Enhanced Corrosion Protection of Steel in Combination with Carboxymethyl Chitosan Grafted Poly(2-methyl-1-vinylimidazole)
Eduok U, Ohaeri E, Szpunar J
Industrial & Engineering Chemistry Research, 58(17), 7179, 2019 |
| 3 |
Electrochemical and surface analyses of X70 steel corrosion in simulated acid pickling medium: Effect of poly (N-vinyl imidazole) grafted carboxymethyl chitosan additive
Eduok U, Ohaeri E, Szpunar J
Electrochimica Acta, 278, 302, 2018 |
| 4 |
Hydrogen related degradation in pipeline steel: A review
Ohaeri E, Eduok U, Szpunar J
International Journal of Hydrogen Energy, 43(31), 14584, 2018 |
| 5 |
Ceria/Acrylic Polymer Microgel Composite: Synthesis, Characterization, and Anticorrosion Application for API 5L X70 Substrate in Chloride-Enriched Medium
Eduok U, Jossou E, Tiamiyu A, Omale J, Szpunar J
Industrial & Engineering Chemistry Research, 56(19), 5586, 2017 |
| 6 |
Hydrogen storage on bare Cu atom and Cu-functionalized boron-doped graphene: A first principles study
Faye O, Eduok U, Szpunar J, Szpunar B, Samoura A, Beye A
International Journal of Hydrogen Energy, 42(7), 4233, 2017 |
| 7 |
The oxidation resistance of thermo-mechanically processed Incoloy 800HT in supercritical water
Akhiani H, Nezakat M, Penttila S, Szpunar J
Journal of Supercritical Fluids, 101, 150, 2015 |
| 8 |
Deformation mechanism and texture and microstructure evolution during high-speed rolling of AZ31B Mg sheets
Li HL, Hsu E, Szpunar J, Utsunomiya H, Sakai T
Journal of Materials Science, 43(22), 7148, 2008 |
| 9 |
Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction
Mirpuri K, Wendrock H, Menzel S, Wetzig K, Szpunar J
Thin Solid Films, 496(2), 703, 2006 |
| 10 |
Orientation and microstructure dependence of electromigration damage in damascene Cu interconnect lines
Mirpuri KK, Szpunar J
Materials Science Forum, 495-497, 1443, 2005 |
