화학공학소재연구정보센터
검색결과 : 2건
No. Article
1 Kinetics of intermetallic phase growth and determination of diffusion coefficients in solid-solid-state reaction between Cu and (Sn+1at.%Ni) pads
Wierzbicka-Miernik A, Miernik K, Filipek R, Szyszkiewicz K
Journal of Materials Science, 52(17), 10533, 2017
2 Growth kinetics of the intermetallic phase in diffusion-soldered (Cu-5 at.%Ni)/Sn/(Cu-5 at.%Ni) interconnections
Wierzbicka-Miernik A, Miernik K, Wojewoda-Budka J, Szyszkiewicz K, Filipek R, Litynska-Dobrzynska L, Kodentsov A, Zieba P
Materials Chemistry and Physics, 142(2-3), 682, 2013