검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Cu/Capping Layer/NiSi 접촉의 상호확산 유정주, 배규식 Korean Journal of Materials Research, 17(9), 463, 2007 |
| 2 |
TiN, TaN and WxN as diffusion barriers for Cu on SiO2: capacitance-voltage, leakage current, and triangular-voltage-sweep tests after bias temperature stress Kizil H, Steinbruchel C Thin Solid Films, 449(1-2), 158, 2004 |
| 3 |
Ta 2 O 5 고유전박막의 미세조직과 열적안정성 민석홍, 정병길, 최재호, 김병성, 김대용, 신동우, 조성래, 김기범 Korean Journal of Materials Research, 12(10), 814, 2002 |
| 4 |
Interdiffusion studies of single crystal TiN/NbN superlattice thin films Engstrom C, Birch J, Hultman L, Lavoie C, Cabral C, Jordan-Sweet JL, Carlsson JRA Journal of Vacuum Science & Technology A, 17(5), 2920, 1999 |