검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
High-Hole-Mobility Silicon Germanium on Insulator Substrates with High Crystalline Quality Obtained by the Germanium Condensation Technique Souriau L, Nguyen T, Augendre E, Loo R, Terzieva V, Caymax M, Cristoloveanu S, Meuris M, Vandervorst W Journal of the Electrochemical Society, 156(3), H208, 2009 |
| 2 |
Germanium MOSFET devices: Advances in materials understanding, process development, and electrical performance Brunco DP, De Jaeger B, Eneman G, Mitard J, Hellings G, Satta A, Terzieva V, Souriau L, Leys FE, Pourtois G, Houssa M, Winderickx G, Vrancken E, Sioncke S, Opsomer K, Nicholas G, Caymax M, Stesmans A, Van Steenbergen J, Mertens PW, Meuris M, Heyns MM Journal of the Electrochemical Society, 155(7), H552, 2008 |
| 3 |
Characterization of threading dislocations in thin germanium layers by defect etching: Toward chromium and HF-Free solution Souriau L, Atanasova T, Terzieva V, Moussa A, Caymax M, Loo R, Meuris M, Vandervorst W Journal of the Electrochemical Society, 155(9), H677, 2008 |
| 4 |
High Ge content SGOI substrates obtained by the Ge condensation technique: A template for growth of strained epitaxial Ge Souriau L, Terzieva V, Vandervorst W, Clemente F, Brijs B, Moussa A, Meuris M, Loo R, Caymax M Thin Solid Films, 517(1), 23, 2008 |
| 5 |
Benefits and side effects of high temperature anneal used to reduce threading dislocation defects in epitaxial Ge layers on Si substrates Terzieva V, Souriau L, Caymax M, Brunco DP, Moussa A, Van Elshocht S, Loo R, Clemente F, Satta A, Meuris M Thin Solid Films, 517(1), 172, 2008 |
| 6 |
Corrosion and inhibition of WNXCY barrier during chemical mechanical planarization Ernur D, Terzieva V, Schuhmacher J, Sutcliffe V, Whelan CM, Maex K Journal of the Electrochemical Society, 152(12), B512, 2005 |
| 7 |
Corrosion of narrow copper damascene interconnects Ernur D, Terzieva V, Wu W, Brongersma SH, Maex K Journal of the Electrochemical Society, 151(12), B636, 2004 |
| 8 |
Surface and grain boundary scattering studied in beveled polycrystalline thin copper films Zhang W, Brongersma SH, Clarysse T, Terzieva V, Rosseel E, Vandervorst W, Maex K Journal of Vacuum Science & Technology B, 22(4), 1830, 2004 |
| 9 |
Codeposition of hydrophilic and hydrophobic silica with copper from acid copper sulfate baths Terzieva V, Fransaer J, Celis JP Journal of the Electrochemical Society, 147(1), 198, 2000 |