| 1 |
Role of nanoscale Cu/Ta interfaces on the shock compression and spall failure of nanocrystalline Cu/Ta systems at the atomic scales
Chen J, Tschopp MA, Dongare AM
Journal of Materials Science, 53(8), 5745, 2018 |
| 2 |
Bridging atomistic simulations and experiments via virtual diffraction: understanding homophase grain boundary and heterophase interface structures
Coleman SP, Tschopp MA, Weinberger CR, Spearot DE
Journal of Materials Science, 51(3), 1251, 2016 |
| 3 |
Simulations of tensile bond rupture in single alkane molecules using reactive interatomic potentials
Nouranian S, Gwaltney SR, Baskes MI, Tschopp MA, Horstemeyer MF
Chemical Physics Letters, 635, 278, 2015 |
| 4 |
Molecular dynamics simulations of deformation mechanisms of amorphous polyethylene
Hossain D, Tschopp MA, Ward DK, Bouvard JL, Wang P, Horstemeyer MF
Polymer, 51(25), 6071, 2010 |
| 5 |
Structural unit and faceting description of Sigma 3 asymmetric tilt grain boundaries
Tschopp MA, McDowell DL
Journal of Materials Science, 42(18), 7806, 2007 |
