검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Effects of collimator aspects ratio and deposition temperature on copper sputtered seedlayers Cooney EC, Strippe DC, Korejwa JW, Simon AH, Uzoh C Journal of Vacuum Science & Technology A, 17(4), 1898, 1999 |
| 2 |
Copper Interconnection Integration and Reliability Hu CK, Luther B, Kaufman FB, Hummel J, Uzoh C, Pearson DJ Thin Solid Films, 262(1-2), 84, 1995 |