화학공학소재연구정보센터
검색결과 : 13건
No. Article
1 Gas permeability of homogeneous and composite membranes based on poly(trimethylsilylpropyne)/poly(vinyltrimethylsilane) blends
Malakhov AO, Dibrov GA, Litvinova EG, Novitsky EG
Petroleum Chemistry, 55(10), 803, 2015
2 Interaction of polymeric Si : C : H films with copper substrates and with deposited Cu adatoms
Tong J, Martini D, Magtoto N, Pritchett M, Kelber J
Applied Surface Science, 187(3-4), 253, 2002
3 Fourier transform infrared diagnostics of gas phase reactions in the metalorganic chemical vapor deposition of aluminum from dimethylethylamine alane
Yun JH, Park MY, Rhee SW
Journal of Vacuum Science & Technology A, 16(2), 419, 1998
4 Field-Aided Thermal Chemical-Vapor-Deposition of Copper Using Cu(I) Organometallic Precursor
Lee WJ, Rha SK, Lee SY, Park CO
Journal of the Electrochemical Society, 144(2), 683, 1997
5 Numerical-Simulation of Metallorganic Chemical-Vapor-Deposition of Copper in a Single-Wafer Reactor
Kim BM, Lee HH
Journal of the Electrochemical Society, 144(5), 1765, 1997
6 Manufacturability of Chemical-Vapor-Deposition of Copper
Nguyen T, Charneski LJ, Hsu ST
Journal of the Electrochemical Society, 144(8), 2829, 1997
7 Nucleation reactions and film growth of copper on TiN using hexafluoroacetylacetonate copper(I) trimethylvinylsilane
Kim DH, Lee YJ, Park CO, Park JW, Kim JJ
Chemical Engineering Communications, 153, 307, 1996
8 Growth and Resistivity Behavior of Copper Film by Chemical-Vapor-Deposition
Choi ES, Park SK, Lee HH
Journal of the Electrochemical Society, 143(2), 624, 1996
9 Characterization of Thin Copper-Films Grown via Chemical-Vapor-Deposition Using Liquid Coinjection of Trimethylvinylsilane and (Hexafluoroacetylacetonate) Cu (Trimethylvinylsilane)
Parmeter JE, Petersen GA, Smith PM, Apblett CA, Reid JS, Norman JA, Hochberg AK, Roberts DA, Omstead TR
Journal of Vacuum Science & Technology B, 13(1), 130, 1995
10 Physical and Spectroscopic Studies of the Nucleation and Growth of Copper Thin-Films on Polyimide Surfaces by Chemical-Vapor-Deposition
Jeon NL, Nuzzo RG
Langmuir, 11(1), 341, 1995