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Gas permeability of homogeneous and composite membranes based on poly(trimethylsilylpropyne)/poly(vinyltrimethylsilane) blends Malakhov AO, Dibrov GA, Litvinova EG, Novitsky EG Petroleum Chemistry, 55(10), 803, 2015 |
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Interaction of polymeric Si : C : H films with copper substrates and with deposited Cu adatoms Tong J, Martini D, Magtoto N, Pritchett M, Kelber J Applied Surface Science, 187(3-4), 253, 2002 |
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Fourier transform infrared diagnostics of gas phase reactions in the metalorganic chemical vapor deposition of aluminum from dimethylethylamine alane Yun JH, Park MY, Rhee SW Journal of Vacuum Science & Technology A, 16(2), 419, 1998 |
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Field-Aided Thermal Chemical-Vapor-Deposition of Copper Using Cu(I) Organometallic Precursor Lee WJ, Rha SK, Lee SY, Park CO Journal of the Electrochemical Society, 144(2), 683, 1997 |
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Numerical-Simulation of Metallorganic Chemical-Vapor-Deposition of Copper in a Single-Wafer Reactor Kim BM, Lee HH Journal of the Electrochemical Society, 144(5), 1765, 1997 |
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Manufacturability of Chemical-Vapor-Deposition of Copper Nguyen T, Charneski LJ, Hsu ST Journal of the Electrochemical Society, 144(8), 2829, 1997 |
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Nucleation reactions and film growth of copper on TiN using hexafluoroacetylacetonate copper(I) trimethylvinylsilane Kim DH, Lee YJ, Park CO, Park JW, Kim JJ Chemical Engineering Communications, 153, 307, 1996 |
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Growth and Resistivity Behavior of Copper Film by Chemical-Vapor-Deposition Choi ES, Park SK, Lee HH Journal of the Electrochemical Society, 143(2), 624, 1996 |
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Characterization of Thin Copper-Films Grown via Chemical-Vapor-Deposition Using Liquid Coinjection of Trimethylvinylsilane and (Hexafluoroacetylacetonate) Cu (Trimethylvinylsilane) Parmeter JE, Petersen GA, Smith PM, Apblett CA, Reid JS, Norman JA, Hochberg AK, Roberts DA, Omstead TR Journal of Vacuum Science & Technology B, 13(1), 130, 1995 |
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Physical and Spectroscopic Studies of the Nucleation and Growth of Copper Thin-Films on Polyimide Surfaces by Chemical-Vapor-Deposition Jeon NL, Nuzzo RG Langmuir, 11(1), 341, 1995 |