화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 H2O Diffusion Barriers at Si-Si Direct Bonding Interfaces for Low Temperature Anneals
Moriceau H, Rieutord F, Libralesso L, Ventosa C, Fournel F, Morales C, Mc Cormick T, Chevolleau T, Radu I
Journal of the Electrochemical Society, 158(9), H919, 2011
2 Mechanism of Thermal Silicon Oxide Direct Wafer Bonding
Ventosa C, Morales C, Libralesso L, Fournel F, Papon AM, Lafond D, Moriceau H, Penot JD, Rieutord F
Electrochemical and Solid State Letters, 12(10), H373, 2009
3 Prebonding Thermal Treatment in Direct Si-Si Hydrophilic Wafer Bonding
Ventosa C, Rieutord F, Libralesso L, Fournel F, Morales C, Moriceau H
Journal of the Electrochemical Society, 156(11), H818, 2009