검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Yim MJ, Li Y, Moon KS, Paik KW, Wong CP Journal of Adhesion Science and Technology, 22(14), 1593, 2008 |
| 2 |
Overview of High Performance 3D-WLP Kim EK Korean Journal of Materials Research, 17(7), 347, 2007 |
| 3 |
Low-cost circuit solutions for micro- and millimeter-wave systems using commercially available SiGe technologies Schumacher H, Abele P, Sonmez E, Schad KB, Trasser A Applied Surface Science, 224(1-4), 410, 2004 |