검색결과 : 16건
| No. | Article |
|---|---|
| 1 |
Sidewall damage in plasma etching of Si/SiGe heterostructures Ding R, Klein LJ, Friesen MG, Eriksson MA, Wendt AE Journal of Vacuum Science & Technology A, 27(4), 836, 2009 |
| 2 |
Plasma etch removal of poly(methyl methacrylate) in block copolymer lithography Ting YH, Park SM, Liu CC, Liu XS, Himpsel FJ, Nealey PF, Wendt AE Journal of Vacuum Science & Technology B, 26(5), 1684, 2008 |
| 3 |
Anisotropic fluorocarbon plasma etching of Si/SiGe heterostructures Ding R, Klein LJ, Eriksson MA, Wendt AE Journal of Vacuum Science & Technology B, 25(2), 404, 2007 |
| 4 |
Ion energy control at substrates during plasma etching of patterned structures Silapunt R, Wendt AE, Kirmse KHR Journal of Vacuum Science & Technology B, 25(6), 1882, 2007 |
| 5 |
Pattern transfer using poly(styrene-block-methyl methacrylate) copolymer films and reactive ion etching Liu CC, Nealey PF, Ting YH, Wendt AE Journal of Vacuum Science & Technology B, 25(6), 1963, 2007 |
| 6 |
Ion bombardment energy control for selective fluorocarbon plasma etching of organosilicate glass Silapunt R, Wendt AE, Kirmse K, Losey LP Journal of Vacuum Science & Technology B, 22(2), 826, 2004 |
| 7 |
Fabrication of polymeric substrates with well-defined nanometer-scale topography and tailored surface chemistry Kim SR, Teixeira AI, Nealey PF, Wendt AE, Abbott NL Advanced Materials, 14(20), 1468, 2002 |
| 8 |
Ion bombardment energy and SiO2/Si fluorocarbon plasma etch selectivity Wang SB, Wendt AE Journal of Vacuum Science & Technology A, 19(5), 2425, 2001 |
| 9 |
Interactions between plasmas in ionized physical vapor deposition discharges Andrew Y, Lu Z, Snodgrass T, Teitzel G, Wendt AE Journal of Vacuum Science & Technology A, 18(5), 2137, 2000 |
| 10 |
Determination of metal vapor ion concentration in an argon/copper plasma for ionized physical vapor deposition (vol A16, pg 2198, 1998) Foster JE, Wendt AE, Wang WW, Booske JH Journal of Vacuum Science & Technology A, 17(1), 322, 1999 |