검색결과 : 13건
| No. | Article |
|---|---|
| 1 |
Opposing Temperature Dependence of the Stretching Response of Single PEG and PNiPAM Polymers Kolberg A, Wenzel C, Hackenstrass K, Schwarzl R, Ruttiger C, Hugel T, Gallei M, Netz RR, Balzer BN Journal of the American Chemical Society, 141(29), 11603, 2019 |
| 2 |
Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties Wojcik H, Junige M, Bartha W, Albert M, Neumann V, Merkel U, Peeva A, Gluch J, Menzel S, Munnik F, Liske R, Utess D, Richter I, Klein C, Engelmann HJ, Ho P, Hossbach C, Wenzel C Journal of the Electrochemical Society, 159(2), H166, 2012 |
| 3 |
Effect of nitrogen content on the degradation mechanisms of thin Ta-Si-N diffusion barriers for Cu metallization Hubner R, Hecker M, Mattern N, Hoffmann V, Wetzig K, Heuer H, Wenzel C, Engelmann HJ, Gehre D, Zschech E Thin Solid Films, 500(1-2), 259, 2006 |
| 4 |
Thin tantalum-silicon-oxygen/tantalum-silicon-nitrogen films as high efficiency humidity diffusion barriers for solar cell encapsulation Heuer H, Wenzel C, Herrmann D, Hubner R, Zhang ZL, Bartha JW Thin Solid Films, 515(4), 1612, 2006 |
| 5 |
The effect of silicon ion implantation on the structure of tantalum-silicon contacts Peikert M, Bhandari R, Wieser E, Wenzel C, Lipp D, Reuther H, Mucklich A Thin Solid Films, 449(1-2), 187, 2004 |
| 6 |
Degradation mechanisms of Ta and Ta-Si diffusion barriers during thermal stressing Hubner R, Hecker M, Mattern N, Hoffmann V, Wetzig K, Wenger C, Engelmann HJ, Wenzel C, Zschech E Thin Solid Films, 458(1-2), 237, 2004 |
| 7 |
Influence of nitrogen content on the crystallization behavior of thin Ta-Si-N diffusion barriers Hubner R, Hecker M, Mattern N, Voss A, Acker J, Hoffmann V, Wetzig K, Engelmann HJ, Zschech E, Heuer H, Wenzel C Thin Solid Films, 468(1-2), 183, 2004 |
| 8 |
Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2 Hubner R, Hecker M, Mattern N, Hoffmann V, Wetzig K, Wenger C, Engelmann HJ, Wenzel C, Zschech E, Bartha JW Thin Solid Films, 437(1-2), 248, 2003 |
| 9 |
Improvement of Ta-based thin film barriers on copper by ion implantation of nitrogen and oxygen Wieser E, Peikert M, Wenzel C, Schreiber J, Bartha JW, Bendjus B, Melov VV, Reuther H, Mucklich A, Adolphi B, Fischer D Thin Solid Films, 410(1-2), 121, 2002 |
| 10 |
Influence of N content on microstructure and thermal stability of Ta-N thin films for Cu interconnection Hecker M, Fischer D, Hoffmann V, Engelmann HJ, Voss A, Mattern N, Wenzel C, Vogt C, Zschech E Thin Solid Films, 414(2), 184, 2002 |