검색결과 : 17건
| No. | Article |
|---|---|
| 1 |
Prediction of recrystallization times in electroplated copper thin films Treger M, Witt C, Cabral C, Murray C, Jordan-Sweet J, Rosenberg R, Eisenbraun E, Noyan IC Thin Solid Films, 615, 107, 2016 |
| 2 |
Effect of Pre-heat and Inert Gas Species on Cryogenic Aerosol Cleaning Performance in Semiconductor Manufacturing Kumari S, Pillai K, Sharma A, Mihevc E, Srivastava A, Chan A, Witt C, Scott S Particulate Science and Technology, 33(5), 562, 2015 |
| 3 |
MuRF1 is a muscle fiber-type II associated factor and together with MuRF2 regulates type-II fiber trophicity and maintenance Moriscot AS, Baptista IL, Bogomolovas J, Witt C, Hirner S, Granzier H, Labeit S Journal of Structural Biology, 170(2), 344, 2010 |
| 4 |
Thermal Sealants Improve Cementing in SAGD Areas Witt C, Tahmourpour F Journal of Canadian Petroleum Technology, 48(6), 39, 2009 |
| 5 |
Osmium barriers for direct copper electrodeposition in Damascene processing Josell D, Witt C, Moffat TP Electrochemical and Solid State Letters, 9(2), C41, 2006 |
| 6 |
Osmium barriers for direct copper electrodeposition in damascene processing (vol 9, pg C41, 2006) Josell D, Witt C, Moffat TP Electrochemical and Solid State Letters, 9(5), L3, 2006 |
| 7 |
Electrodeposition of Cu on Ru barrier layers for damascene processing Moffat TP, Walker M, Chen PJ, Bonevich JE, Egelhoff WF, Richter L, Witt C, Aaltonen T, Ritala M, Leskela M, Josell D Journal of the Electrochemical Society, 153(1), C37, 2006 |
| 8 |
Electrodeposition of Cu on Ru barrier layers for damascene processing (vol 153, pg C37, 2005) Moffat TP, Walker M, Chen PJ, Bonevich JE, Egelhoff WF, Richter L, Witt C, Aaltonen T, Ritala M, Leskela M, Josella D Journal of the Electrochemical Society, 153(3), L5, 2006 |
| 9 |
Integration of thin electroless copper films in copper interconnect metallization Webb E, Witt C, Andryuschenko T, Reid J Journal of Applied Electrochemistry, 34(3), 291, 2004 |
| 10 |
Superconformal silver deposition using KSeCN derivatized substrates Baker BC, Witt C, Wheeler D, Josell D, Moffat TP Electrochemical and Solid State Letters, 6(5), C67, 2003 |