검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
CO2 promotes penetration and removal of aqueous hydrocarbon surfactant cleaning solutions and silylation in low-k dielectrics with 3 nm pores Keagy JA, Li Y, Green PF, Johnston KP, Weber F, Rhoad JT, Busch EL, Wolf PJ Journal of Supercritical Fluids, 42(3), 398, 2007 |
| 2 |
Cleaning of patterned porous low-k dielectrics with water, carbon dioxide and ambidextrous surfactants Keagy JA, Zhang XG, Johnston KP, Busch E, Weber F, Wolf PJ, Rhoad T Journal of Supercritical Fluids, 39(2), 277, 2006 |
| 3 |
Water-in-carbon dioxide microemulsions for removing post-etch residues from patterned porous low-k dielectrics Zhang XG, Pham JQ, Martinez HJ, Wolf PJ, Green PF, Johnston KP Journal of Vacuum Science & Technology B, 21(6), 2590, 2003 |