화학공학소재연구정보센터
검색결과 : 13건
No. Article
1 On the Displacement of Adsorbed Polyethylene Glycol by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition
Kreider A, Barkey DP, Wong EH
Journal of the Electrochemical Society, 161(12), D663, 2014
2 NMR Spectral Studies of Interactions Between the Accelerants SPS and MPS and Copper Chlorides
Garcia-Cardona E, Wong EH, Barkey DP
Journal of the Electrochemical Society, 158(3), D143, 2011
3 Coordinating Radiometals of Copper, Gallium, Indium, Yttrium, and Zirconium for PET and SPECT Imaging of Disease
Wadas TJ, Wong EH, Weisman GR, Anderson CJ
Chemical Reviews, 110(5), 2858, 2010
4 Copper-based ATRP catalysts of very high activity derived from dimethyl cross-bridged cyclam
Tsarevsky NV, Braunecker WA, Tang W, Brooks SJ, Matyjaszewski K, Weisman GR, Wong EH
Journal of Molecular Catalysis A-Chemical, 257(1-2), 132, 2006
5 Direct measurement of cure-induced stress in thermosetting materials by means of a dynamic mechanical analyzer
Yu H, Mhaisalkar SG, Wong EH
Macromolecular Rapid Communications, 27(16), 1393, 2006
6 Time-temperature transformation (TTT) cure diagram of a fast cure non-conductive adhesive
Yu H, Mhaisalkar SG, Wong EH, Khoo GY
Thin Solid Films, 504(1-2), 331, 2006
7 Characterization of optical properties of acrylate based adhesives exposed to different temperature conditions
Priyadarshi A, Shimin L, Mhaisalkar SG, Rajoo R, Wong EH, Kripesh V, Namdas EB
Journal of Applied Polymer Science, 98(3), 950, 2005
8 Observations of gelation and vitrification of a thermosetting resin during the evolution of polymerization shrinkage
Yu H, Mhaisalkar SG, Wong EH
Macromolecular Rapid Communications, 26(18), 1483, 2005
9 Static and cyclic relaxation studies in nonconductive adhesives
Gunawan M, Davila LT, Wong EH, Mhaisalkar SG, Tsai TK, Osiyemi S
Thin Solid Films, 462-63, 419, 2004
10 Development and reliability of non-conductive adhesive flip-chip packages
Teh LK, Anto E, Wong CC, Mhaisalkar SG, Wong EH, Teo PS, Chen Z
Thin Solid Films, 462-63, 446, 2004