검색결과 : 7건
| No. | Article |
|---|---|
| 1 |
Strain rate sensitivity and Hall-Petch behavior of ultrafine-grained gold wires Chew YH, Wong CC, Wulff F, Lim FC, Goh HM Thin Solid Films, 516(16), 5376, 2008 |
| 2 |
Effects of Ca on grain boundary cohesion in Au ballbonding wire Chew YH, Wong CC, Breach CD, Wulff F, Lin TT, He CB Thin Solid Films, 504(1-2), 346, 2006 |
| 3 |
Degradation of the Au4Al compound in gold ballbonds during isothermal aging in air at 175 degrees C Breach CD, Tok CW, Wulff F, Calpito D Journal of Materials Science, 39(19), 6125, 2004 |
| 4 |
Effects of calcium and palladium on mechanical properties and stored energy of hard-drawn gold bonding wire Chew YH, Wong CC, Breach CD, Wulff F, Mhaisalkar SG, Pang CI, Saraswati Thin Solid Films, 462-63, 346, 2004 |
| 5 |
The effects of Ca and Pd dopants on gold bonding wire and gold rod Saraswati TS, Sritharan T, Pang CI, Chew YH, Breach CD, Wulff F, Mhaisalkar SG, Wong CC Thin Solid Films, 462-63, 351, 2004 |
| 6 |
Oxidation of bulk Au-Al intermetallics Xu C, Breach CD, Sritharan T, Wulff F, Mhaisalkar SG Thin Solid Films, 462-63, 357, 2004 |
| 7 |
Crystallographic texture of drawn gold bonding wires using electron backscattered diffraction (EBSD) Wulff F, Breach CD, Dittmer K Journal of Materials Science Letters, 22(19), 1373, 2003 |