| 1 |
Preparations of Polystyrene/Aluminum Hydroxide and Polystyrene/Alumina Composite Particles in an Ionic Liquid
Kinoshita K, Minami H, Tarutani Y, Tajima K, Okubo M, Yanagimoto H
Langmuir, 27(8), 4474, 2011 |
| 2 |
Fabrication of Silver Patterns on Polyimide Films Based on Solid-Phase Electrochemical Constructive Lithography Using Ion-Exchangeable Precursor Layers
Akamatsu K, Fukumoto Y, Taniyama T, Tsuruoka T, Yanagimoto H, Nawafune H
Langmuir, 27(19), 11761, 2011 |
| 3 |
Copper/polyimide heterojunctions: Controlling interfacial structures through an additive-based, all-wet chemical process using ion-doped precursors
Ikeda S, Yanagimoto H, Akamatsu K, Nawafune H
Advanced Functional Materials, 17(6), 889, 2007 |
| 4 |
Selective electroless copper deposition on aluminum nitride substrate with patterned copper seed layer
Yanagimoto H, Deki S, Akamatsu K, Gotoh K
Thin Solid Films, 491(1-2), 18, 2005 |
| 5 |
Direct patterning of copper on polyimide using ion exchangeable surface templates generated by site-selective surface modification
Akamatsu K, Ikeda S, Nawafune H, Yanagimoto H
Journal of the American Chemical Society, 126(35), 10822, 2004 |
| 6 |
Fabrication of copper film on aluminum nitride by novel electroless plating
Yanagimoto H, Akamatsu K, Deki S, Gotoh K
Journal of the Electrochemical Society, 150(4), C260, 2003 |
| 7 |
Novel copper electroless plating process on ceramic substrate using copper oxide particles
Yanagimoto H, Akamatsu K, Deki S, Gotoh K
Electrochemical and Solid State Letters, 5(9), C87, 2002 |
| 8 |
Properties and Application of Organic-Dye Associates in Polymer Matrices
Hiraga T, Tanaka N, Yanagimoto H, Hayamizu K, Moriya T
Thin Solid Films, 273(1-2), 190, 1996 |
