검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability Yi SM, An JU, Hwang SS, Yim JR, Huh YH, Park YB, Joo YC Thin Solid Films, 516(8), 2325, 2008 |
| No. | Article |
|---|---|
| 1 |
Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability Yi SM, An JU, Hwang SS, Yim JR, Huh YH, Park YB, Joo YC Thin Solid Films, 516(8), 2325, 2008 |