검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects Haase J, Farley D, Iyer P, Baumgartner P, Dasgupta A, Caers JFJ Journal of Adhesion Science and Technology, 22(14), 1733, 2008 |
| 2 |
Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering Li Y, Moon KS, Wong CP Journal of Applied Polymer Science, 99(4), 1665, 2006 |