| 1 |
Design and optimization ofGaN-based betavoltaic cell for enhanced output power density
Yoon YJ, Lee JS, Kang IM, Lee JH, Kim DS
International Journal of Energy Research, 45(1), 799, 2021 |
| 2 |
Enhanced efficiency for dye-sensitized solar cells with ZrO2 as a barrier layer on TiO2 nanofibers
Yang XJ, Zhao L, Lv KL, Dong BH, Wang SM
Applied Surface Science, 469, 821, 2019 |
| 3 |
On-substrate porous-anodic-alumina-assisted gold nanostructure arrays: Meeting the challenges of various sizes and interfaces
Mozalev A, Hubalek J
Electrochimica Acta, 297, 988, 2019 |
| 4 |
Distribution of relaxation times analysis and interfacial effects of LSCF fired at different temperatures
DiGiuseppe G, Thompson D, Gumeci C, Hussain AM, Dale N
International Journal of Hydrogen Energy, 44(49), 27067, 2019 |
| 5 |
Enhanced thermal stability by introducing TiN diffusion barrier layer between W and SiC
Cheng P, DelaCruz S, Tsai DS, Wang ZT, Carraro C, Maboudian R
Journal of the American Ceramic Society, 102(9), 5613, 2019 |
| 6 |
Electrochemical behaviour and temperature dependent electrical transitions in graphene oxide incorporated poly(vinyl alcohol)/poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) composites for dielectric and supercapacitor applications
Mydhili V, Kavinkumar T, Neppolian B, Manivannan S
Materials Chemistry and Physics, 225, 261, 2019 |
| 7 |
CrAlSiN barrier layer to improve the thermal stability of W/CrAlSiNx/CrAlSiOyNx/SiAlOx solar thermal absorber
AL-Rjoub A, Rebouta L, Costa P, Vieira LG, Miranda TMR, Barradas NP, Alves E
Solar Energy Materials and Solar Cells, 191, 235, 2019 |
| 8 |
Synaptic behaviors of HfO2 ReRAM by pulse frequency modulation
Lee DK, Kim MH, Kim TH, Bang S, Choi YJ, Kim S, Cho S, Park BG
Solid-State Electronics, 154, 31, 2019 |
| 9 |
Ultra-fine structures of Pd-Ag-HAp nanoparticle deposition on protruded TiO2 barrier layer for dental implant
Jang JM, Kim SD, Park TE, Choe HC
Applied Surface Science, 432, 285, 2018 |
| 10 |
Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution
Chen ST, Cheng YS, Chang YH, Yang TM, Lee JT, Chen GS
Applied Surface Science, 440, 209, 2018 |
