검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Stress relaxation during bond formation and adhesion of pressure-sensitive adhesives Novikov MB, Gdalin BE, Anosova JV, Feldstein MM Journal of Adhesion, 84(2), 164, 2008 |
| 2 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects Haase J, Farley D, Iyer P, Baumgartner P, Dasgupta A, Caers JFJ Journal of Adhesion Science and Technology, 22(14), 1733, 2008 |
| 3 |
The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness Gomatam RR, Sancaktar E Journal of Adhesion Science and Technology, 18(11), 1225, 2004 |
| 4 |
The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure Gomatam RR, Sancaktar E Journal of Adhesion Science and Technology, 18(11), 1245, 2004 |