| 1 |
Optimization of interconnect flow channels width in a planar solid oxide fuel cell
Li XL, Shi WY, Han MF
International Journal of Hydrogen Energy, 43(46), 21524, 2018 |
| 2 |
Effect of structural parameters on pool boiling heat transfer for porous interconnected microchannel nets
Tang Y, Zeng J, Zhang SW, Chen C, Chen JL
International Journal of Heat and Mass Transfer, 93, 906, 2016 |
| 3 |
An experimental investigation on thermal characteristics of sidewall fires in corridor-like structures with varying width
Ji J, Fu YY, Fan CG, Gao ZH, Li KY
International Journal of Heat and Mass Transfer, 84, 562, 2015 |
| 4 |
Sensitivity of the performance of a flat-plate liquid-to-air membrane energy exchanger (LAMEE) to the air and solution channel widths and flow maldistribution
Abdel-Salam MRH, Besant RW, Simonson CJ
International Journal of Heat and Mass Transfer, 84, 1082, 2015 |
| 5 |
Modeling the temperature distribution and performance of a PEM fuel cell with thermal contact resistance
Cao TF, Mu YT, Ding J, Lin H, He YL, Tao WQ
International Journal of Heat and Mass Transfer, 87, 544, 2015 |
| 6 |
Crossover effects of the land/channel width ratio of bipolar plates in polymer electrolyte membrane fuel cells
Jung A, Kong IM, Baik KD, Kim MS
International Journal of Hydrogen Energy, 39(36), 21588, 2014 |
| 7 |
Back biasing effects in tri-gate junctionless transistors
Park SJ, Jeon DY, Montes L, Barraud S, Kim GT, Ghibaudo G
Solid-State Electronics, 87, 74, 2013 |
| 8 |
Analysis of heat transfer characteristics of double-layered microchannel heat sink
Hung TC, Yan WM, Li WP
International Journal of Heat and Mass Transfer, 55(11-12), 3090, 2012 |
| 9 |
Correlation between anisotropic bending stiffness of GDL and land/channel width ratio of polymer electrolyte membrane fuel cells
Baik KD, Hong BK, Han K, Kim MS
International Journal of Hydrogen Energy, 37(16), 11921, 2012 |
| 10 |
GIDL behavior of p- and n-MuGFET devices with different TiN metal gate thickness and high-k gate dielectrics
Galeti M, Rodrigues M, Martino JA, Collaert N, Simoen E, Claeys C
Solid-State Electronics, 70, 44, 2012 |
