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Symmetric and asymmetric spiro-type colorless poly(ester imide)s with low coefficients of thermal expansion, high glass transition temperatures, and excellent solution-processability Hasegawa M, Takahashi S, Tsukuda S, Hirai T, Ishii J, Yamashina Y, Kawamura Y Polymer, 169, 167, 2019 |
2 |
Superheat-resistant polymers with low coefficients of thermal expansion Hasegawa M, Hoshino Y, Katsura N, Ishii J Polymer, 111, 91, 2017 |
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High-temperature polymers overcoming the trade-off between excellent thermoplasticity and low thermal expansion properties Hasegawa M, Kaneki T, Tsukui M, Okubo N, Ishii J Polymer, 99, 292, 2016 |
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Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages Yoo T, Kim K, Han P, Jang W, Han H Macromolecular Research, 23(8), 776, 2015 |
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Optically transparent aromatic poly(ester imide)s with low coefficients of thermal expansion (1). Self-orientation behavior during solution casting process and substituent effect Hasegawa M, Ishigami T, Ishii J Polymer, 74, 1, 2015 |
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Stress analyses for the glass joints of contemporary sodium sulfur batteries Jung K, Lee S, Kim G, Kim CS Journal of Power Sources, 269, 773, 2014 |
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Solution-Processable Colorless Polyimides Derived from Hydrogenated Pyromellitic Dianhydride with Controlled Steric Structure Hasegawa M, Hirano D, Fujii M, Haga M, Takezawa E, Yamaguchi S, Ishikawa A, Kagayama T Journal of Polymer Science Part A: Polymer Chemistry, 51(3), 575, 2013 |
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Thermal properties of silicon powder filled high-density polyethylene composites Dey TK, Tripathi M Thermochimica Acta, 502(1-2), 35, 2010 |
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Optimization of La2O3-containing diopside based glass-ceramic sealants for fuel cell applications Goel A, Tulyaganov DU, Kharton VV, Yaremchenko AA, Eriksson S, Ferreira JMF Journal of Power Sources, 189(2), 1032, 2009 |
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Effect of structural changes of silica filler on the coefficient of thermal expansion (CTE) of underfill encapsulant Palaniandy S, Azizli KAM, Jaafar M, Ahmad FN, Hussin H, Hashim SFS Powder Technology, 185(1), 54, 2008 |