| 1 |
Thermal evolution study of nonmetallic impurities and surface passivation of Cu nanopowders produced via a DC thermal plasma synthesis
Krasovskii PV, Samokhin AV, Fadeev AA, Alexeev NV
Advanced Powder Technology, 27(4), 1669, 2016 |
| 2 |
Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
Li J, Liu YH, Wang TQ, Lu XC, Luo JB
Applied Surface Science, 265, 764, 2013 |
| 3 |
Monitoring passivation of Cu-Sb and Cu-Pb anodes during electrorefining employing electrochemical noise analyses
Safizadeh F, Ghali E
Electrochimica Acta, 56(1), 93, 2010 |
| 4 |
In situ atomic force microscopy investigation of copper behaviour and polypyrrole deposition from salicylate medium
Cascalheira AC, Viana AS, Abrantes LM
Electrochimica Acta, 53(19), 5783, 2008 |
| 5 |
Applications of surface X-ray scattering to electrochemistry problems
Nagy Z, You H
Electrochimica Acta, 47(19), 3037, 2002 |
| 6 |
Sputter-deposited Mo and reactively sputter-deposited Mo-N films as barrier layers against Cu diffusion
Chuang JC, Tu SL, Chen MC
Thin Solid Films, 346(1-2), 299, 1999 |
| 7 |
Encapsulation of Silver by Nitridation of Ag-Ti Alloy Bilayer Structures
Laursen T, Adams D, Alford TL, Tu KN, Deng F, Morton R, Lau SS
Thin Solid Films, 290-291, 411, 1996 |
