1 |
Preparation and cure kinetics of epoxy with nanodiamond modified with liquid crystalline epoxy Luo X, Yu XY, Ma YH, Naito K, Zhang QX Thermochimica Acta, 663, 1, 2018 |
2 |
Cure Properties of Naphthalene-Based Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials Kim WG, Chun H Molecular Crystals and Liquid Crystals, 579(1), 39, 2013 |
3 |
에폭시/폴리옥시프로필렌 디아민계의 경화 반응속도 및 동역학 특성 분석 황광춘, 이종근 Polymer(Korea), 35(3), 196, 2011 |
4 |
Phase separation, porous structure, and cure kinetics in aliphatic epoxy resin containing hyperbranched polyester Guo QP, Habrard A, Park Y, Halley PJ, Simon GP Journal of Polymer Science Part B: Polymer Physics, 44(6), 889, 2006 |
5 |
Study of Cure Kinetic Modeling of RSL-1895 Epoxy System using Composite Kinetic Methodology Kim SW, Nam JD Journal of Industrial and Engineering Chemistry, 8(3), 212, 2002 |
6 |
Cure modeling and monitoring of epoxy/amine resin systems. I. Cure kinetics modeling Karkanas PI, Partridge IK Journal of Applied Polymer Science, 77(7), 1419, 2000 |
7 |
Blends of an epoxy/cycloaliphatic amine resin with poly(ether imide) Barral L, Cano J, Lopez J, Lopez-Bueno I, Nogueira P, Abad MJ, Ramirez C Polymer, 41(7), 2657, 2000 |
8 |
Polymer Networks Derived from the Anhydride Curing of Tetraepoxides Corcuera MA, Mondragon I, Riccardi CC, Williams RJ Journal of Applied Polymer Science, 64(1), 157, 1997 |
9 |
A DSC Kinetic-Study on the Effect of Filler Concentration on Cross-Linking of Diglycidylether of Bisphenol-A with 4,4’-Diaminodiphenyl Methane de Miranda MIG, Tomedi C, Bica CID, Samios D Polymer, 38(5), 1017, 1997 |