| 1 |
Nanoporous structured Sn-MWCNT/Cu electrodes fabricated by electrodeposition-chemical dezincification for catalytic CO2 reduction
Shao XL, Zhang Q, Zhang XR, Yi J, Liu YY, Zhang JJ
International Journal of Energy Research, 45(4), 6273, 2021 |
| 2 |
Interactions between elemental components during the dealloying of Cu-Zn alloys
Zhou P, Erning JW, Ogle K
Electrochimica Acta, 293, 290, 2019 |
| 3 |
On characterizing microscopically the adhesion interphase for the adhesion between metal and rubber compound Part III. Effect of brass-plating amount for brass-plated steel cord
Jeon GS
Journal of Adhesion Science and Technology, 31(24), 2667, 2017 |
| 4 |
Cu-Zn 황동에서 수소가 탈아연 부식에 미치는 영향
최병학, 이범규, 장현수, 전우일, 박용성, 임재균, 이진희, 박찬성, 김진표
Korean Journal of Materials Research, 27(3), 172, 2017 |
| 5 |
Tarnishing and Cu Ion release in Selected Copper-Base Alloys: Implications towards Antimicrobial Functionality
Horton DJ, Ha H, Foster LL, Bindig HJ, Scully JR
Electrochimica Acta, 169, 351, 2015 |
| 6 |
On characterizing microscopically the adhesion interphase for the adhesion between metal and rubber compound Part II. Effect of copper content for brass-plated steel cord
Jeon GS
Journal of Adhesion Science and Technology, 28(18), 1808, 2014 |
| 7 |
On characterizing microscopically the adhesion interphase for the adhesion between metal and rubber compound part I. Effect of hexamethoxymethylmelamine in rubber compound
Jeon GS
Journal of Adhesion Science and Technology, 27(15), 1666, 2013 |
| 8 |
Dezincification of Steel Scraps
Schonfelder I, Gock E, Vogt V, Carlowitz O, Zeller T, Sauter A
Chemie Ingenieur Technik, 84(10), 1749, 2012 |
| 9 |
Electrochemical behavior of Zn-rich Zn-Cu peritectic alloys affected by macrosegregation and microstructural array
Osorio WR, Brito C, Peixoto LC, Garcia A
Electrochimica Acta, 76, 218, 2012 |
| 10 |
Enhancing the Adhesion Retention by Controlling the Structure of the Adhesion Interphase between Rubber Compound and Metal. Part II. Effect of Zinc Borate
Jeon GS
Journal of Adhesion Science and Technology, 24(4), 709, 2010 |
