1 |
Boosting the cycling stability of LixSi alloy microparticles through electroless copper deposition Wang C, Yu JM, Li SH, Lu ZD Chemical Engineering Journal, 370, 1019, 2019 |
2 |
Low-frequency'delay time' ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material Cobley AJ, Tudela I, Abbas B, Mkhlef B Thin Solid Films, 597, 226, 2015 |
3 |
Specific and mass activity of silver nanocube and nanoparticle-based catalysts for electroless copper deposition Lee CL, Tsai YL, Chen CW Electrochimica Acta, 104, 185, 2013 |
4 |
An optimization analysis on electroless deposition of Al2O3/Cu core-shell nanostructures Beygi H, Sajjadi SA, Zebarjad SM Applied Surface Science, 261, 166, 2012 |
5 |
Effect of electrochemical surface area on electroless copper deposition: Pd nanocubes as new activators Lee CL, Syu CC, Chiou HP, Liu CR, Huang CH Electrochimica Acta, 59, 587, 2012 |
6 |
Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling Schaubroeck D, De Baets J, Desmet T, Dubruel P, Schacht E, Van Vaeck L, Van Calster A Applied Surface Science, 256(21), 6269, 2010 |
7 |
Novel electroless copper deposition on carbon fibers with environmentally friendly processes Byeon JH, Kim JW Journal of Colloid and Interface Science, 348(2), 649, 2010 |
8 |
The autocatalytic reduction of copper(II) by cobalt(II) in aqueous diethylenetriamine solutions studied by EQCM Vaskelis A, Stankeviciene I, Jagminiene A, Tamasauskaite L, Norkus TE Journal of Electroanalytical Chemistry, 622(2), 136, 2008 |
9 |
Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions Vaskelis A, Jaciauskiene J, Stalnionien I, Norkus E Journal of Electroanalytical Chemistry, 600(1), 6, 2007 |
10 |
The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition Kuo LC, Huang YC, Lee CL, Yen YW Electrochimica Acta, 52(1), 353, 2006 |