검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects Haase J, Farley D, Iyer P, Baumgartner P, Dasgupta A, Caers JFJ Journal of Adhesion Science and Technology, 22(14), 1733, 2008 |
| 2 |
Fabrication of a miniature twin-fuel-cell on silicon wafer Yu JR, Cheng P, Ma ZQ, Yi BL Electrochimica Acta, 48(11), 1537, 2003 |