| 1 |
Effects of corona treatment on surface properties of co-extruded transparent polyethylene film
Das B, Chakrabarty D, Guha C, Bose S
Polymer Engineering and Science, 61(5), 1449, 2021 |
| 2 |
Effect of CNT dispersion methods on the strength and fracture mechanism of interface in epoxy adhesive/Al joints
Shokrian MD, Shelesh-Nezhad K, Najjar R
Journal of Adhesion Science and Technology, 33(13), 1394, 2019 |
| 3 |
Relationship between residual stress and strength of single lap joints made of Ti6Al4V alloy, adhesively bonded and treated using pneumatic ball peening
Korzynska K, Zielecki W, Korzynski M
Journal of Adhesion Science and Technology, 32(17), 1849, 2018 |
| 4 |
An adhesive joint strength evaluation method and its application in mechanical engineering
Na JX, Liu Y, Cai L, Tao SZ, Yan YK
Journal of Adhesion Science and Technology, 30(2), 131, 2016 |
| 5 |
Development of optimum process parameters and a study of the effects of surface roughness on brazing of copper
Zaharinie T, Huda Z, Izuana MF, Hamdi M
Applied Surface Science, 331, 127, 2015 |
| 6 |
Interfacial characterization of nickel-yttria-stabilized zirconia cermet anode/interconnect joints with Ag-Pd-Ga active filler for use in solid-oxide fuel cells
Chao CL, Chu CL, Fuh YK, Hsu RQ, Lee S, Cheng YN
International Journal of Hydrogen Energy, 40(3), 1523, 2015 |
| 7 |
Joint strength of a solid oxide fuel cell glass-ceramic sealant with metallic interconnect in a reducing environment
Lin CK, Liu YA, Wu SH, Liu CK, Lee RY
Journal of Power Sources, 280, 272, 2015 |
| 8 |
Creep rupture of the joint of a solid oxide fuel cell glass-ceramic sealant with metallic interconnect
Lin CK, Lin KL, Yeh JH, Wu SH, Lee RY
Journal of Power Sources, 245, 787, 2014 |
| 9 |
In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique
Kim HI, Tian J, Gupta V
Journal of Adhesion Science and Technology, 27(7), 719, 2013 |
| 10 |
Measurement of solder joint strength in freestanding chip-scale packages using a quantitative laser spallation technique
Tian J, Kim HI, Gupta V
Journal of Adhesion Science and Technology, 27(8), 835, 2013 |
