검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique Kim HI, Tian J, Gupta V Journal of Adhesion Science and Technology, 27(7), 719, 2013 |
| 2 |
Measurement of solder joint strength in freestanding chip-scale packages using a quantitative laser spallation technique Tian J, Kim HI, Gupta V Journal of Adhesion Science and Technology, 27(8), 835, 2013 |
| 3 |
Measurement of the intrinsic strength and intrinsic and total fracture resistances of stainless steel/E-glass composite joints Wang XM, Gupta V Journal of Adhesion Science and Technology, 20(11), 1171, 2006 |