검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
New elevated temperature mold compound adhesion test method using a dynamic mechanical analyzer Schoenberg A, Klinkerch E Thermochimica Acta, 442(1-2), 81, 2006 |
| No. | Article |
|---|---|
| 1 |
New elevated temperature mold compound adhesion test method using a dynamic mechanical analyzer Schoenberg A, Klinkerch E Thermochimica Acta, 442(1-2), 81, 2006 |