| 1 |
결정성 바이페닐 에폭시 합성 및 경화 거동 연구
최봉구, 최호경, 최재현, 최중소
Korean Chemical Engineering Research, 58(1), 44, 2020 |
| 2 |
Investigation on curing characterization of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis
Lee DE, Cho HJ, Kong BS, Choi HO
Thermochimica Acta, 674, 68, 2019 |
| 3 |
A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate
Yang SR, Gao F, Qu JM
Polymer, 54(18), 5064, 2013 |
| 4 |
Phenolic resins-100 years of progress and their future
Hirano K, Asami M
Reactive & Functional Polymers, 73(2), 256, 2013 |
| 5 |
Predicted and Measured Bond-Line Read-Through Response in Composite Automotive Body Panels Subjected to Elevated Temperature Cure
Fuchs H, Fernholz KD, Deslauriers P
Journal of Adhesion, 86(10), 982, 2010 |
| 6 |
Effects of particle size of fiberglass-resin powder from PCBs on the properties and volatile behavior of phenolic molding compound
Guo J, Rao QL, Xu ZM
Journal of Hazardous Materials, 175(1-3), 165, 2010 |
| 7 |
Preparation and properties of carbon nanotube-reinforced vinyl ester/nanocomposite bipolar plates for polymer electrolyte membrane fuel cells
Liao SH, Hung CH, Ma CCM, Yen CY, Lin YF, Weng CC
Journal of Power Sources, 176(1), 175, 2008 |
| 8 |
High thermal conductivity epoxy molding compound filled with a combustion synthesized AIN powder
Hsieh CY, Chung SL
Journal of Applied Polymer Science, 102(5), 4734, 2006 |
| 9 |
Preparation and properties of high performance nanocomposite bipolar plate for fuel cell
Yen CY, Liao SH, Lin YF, Hung CH, Lin YY, Ma CCM
Journal of Power Sources, 162(1), 309, 2006 |
| 10 |
A simple reliable method of selecting epoxy molding compounds for high power short wavelength light emitting diode packages
Lee C, Kang S, Yim K, Kim S, Kim H
Materials Science Forum, 510-511, 154, 2006 |
