검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가 김성혁, 이병록, 김재명, 유세훈, 박영배 Korean Journal of Materials Research, 24(3), 166, 2014 |
| 2 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints Wu PL, Huang MK, Lee C, Tzan SR Journal of the Chinese Institute of Chemical Engineers, 35(5), 571, 2004 |