| 1 |
Facile and precise fabrication of 10-nm nanostructures on soft and hard substrates
Woo JY, Jo S, Oh JH, Kim JT, Han CS
Applied Surface Science, 484, 317, 2019 |
| 2 |
Characterization of surface chemistry of PtFe bimetallic nanoparticles
Omelianovych O, Larina LL, Dao VD, Choi HS
Applied Surface Science, 457, 381, 2018 |
| 3 |
Plasma cleaning of old Indian coin in H-2-Ar atmosphere
Pradhan SK, Jeevitha M, Singh SK
Applied Surface Science, 357, 445, 2015 |
| 4 |
Influence of sputter-etching of substrate on the microstructural and optical properties of ZnO films deposited by RF magnetron sputtering
Li CP, Yang BH, Wang XC, Wang F, Li MJ, Su L, Li XW
Applied Surface Science, 257(14), 5998, 2011 |
| 5 |
Use of Urea-Choline Chloride Eutectic Solvent for Back End of Line Cleaning Applications
Thanu DPR, Raghavan S, Keswani M
Electrochemical and Solid State Letters, 14(9), H358, 2011 |
| 6 |
Effect of CF4 Plasma on Properties and Reliability of Metal-Induced Lateral Crystallization Silicon Transistors
Chang CP, Wu YS
Journal of the Electrochemical Society, 157(2), H192, 2010 |
| 7 |
Ultrahigh Selective Etching of SiO2 Using an Amorphous Carbon Mask in Dual-Frequency Capacitively Coupled C4F8/CH2F2/O-2/Ar Plasmas
Kwon BS, Kim JS, Lee NE, Shon JW
Journal of the Electrochemical Society, 157(3), D135, 2010 |
| 8 |
Mechanism of Sidewall Necking and Bowing in the Plasma Etching of High Aspect-Ratio Contact Holes
Lee JK, Jang IY, Lee SH, Kim CK, Moon SH
Journal of the Electrochemical Society, 157(3), D142, 2010 |
| 9 |
Patterning of Cu Films by a Two-Step Plasma Etching Process at Low Temperature
Wu FY, Levitin G, Hess DW
Journal of the Electrochemical Society, 157(4), H474, 2010 |
| 10 |
Fabrication of Nanoelectrodes Using Individual Multiwalled Carbon Nanotubes and Their Cyclic Voltammetric Properties
Hwang S, Vedala H, Kim T, Choi W, Choi H, Jeon M
Journal of the Electrochemical Society, 157(4), K67, 2010 |
