검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness Gomatam RR, Sancaktar E Journal of Adhesion Science and Technology, 18(11), 1225, 2004 |
| 2 |
The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure Gomatam RR, Sancaktar E Journal of Adhesion Science and Technology, 18(11), 1245, 2004 |