| 1 |
Point-bonded polymer nonwovens and their rupture in stretching
Zhang WS, Staszel C, Yarin AL, Shim E, Pourdeyhimi B
Polymer, 146, 209, 2018 |
| 2 |
A Modified Quasi-Creep Model for Assessment of Deformation of Topas COC Substrates in the Thermal Bonding of Microfluidic Devices: Experiments and Modeling
Wang ZY, Yue CY, Lam YC, Roy S, Jena RK
Journal of Applied Polymer Science, 122(2), 867, 2011 |
| 3 |
Morphological, mechanical, and electrical properties as a function of thermal bonding in electrospun nanocomposites
Ramaswamy S, Clarke LI, Gorga RE
Polymer, 52(14), 3183, 2011 |
| 4 |
Thermal Bonding of Nonwovens as Simulated by Polypropylene Films: Effect of Time, Temperature, and Molecular Weight
Michielsen S, Jain S
Journal of Applied Polymer Science, 117(6), 3322, 2010 |
| 5 |
Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding
Mathur A, Roy SS, Tweedie M, Mukhopadhyay S, Mitra SK, McLaughlin JA
Current Applied Physics, 9(6), 1199, 2009 |
| 6 |
Thermal Bonding of Polypropylene Films and Fibers
Hegde RR, Bhat GS, Campbell RA
Journal of Applied Polymer Science, 110(5), 3047, 2008 |
| 7 |
Thermal oxidative degradation of bicomponent PP/PET fiber during thermal bonding process
Wang XY, Gong RH
Journal of Applied Polymer Science, 104(1), 391, 2007 |
| 8 |
Review of thermally point-bonded nonwovens: Materials, processes, and properties
Michielsen S, Pourdeyhimi B, Desai P
Journal of Applied Polymer Science, 99(5), 2489, 2006 |
| 9 |
IPA 저온 접합법을 이용한 PMMA Micro CE Chip의 제작
차남구, 박창화, 임현우, 조민수, 박진구
Korean Journal of Materials Research, 16(2), 99, 2006 |
| 10 |
Effect of processing conditions on the structure and properties of polypropylene spunbond fabrics
Nanjundappa R, Bhat GS
Journal of Applied Polymer Science, 98(6), 2355, 2005 |
