| 1 |
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient
Zhong Y, Zhao N, Dong W, Wang YP, Ma HT
Materials Chemistry and Physics, 216, 130, 2018 |
| 2 |
Thermomigration kinetics and a novel method to determine the chemical diffusivity of a mixed conductor
Lee T, Yoo HI
Solid State Ionics, 300, 212, 2017 |
| 3 |
Electromigration in Sn-Ag solder thin films under high current density
Zhu X, Kotadia H, Xu S, Lu H, Mannan SH, Bailey C, Chan YC
Thin Solid Films, 565, 193, 2014 |
| 4 |
Time-dependent changes in morphology and resistance of W/TiN/Ti metal lines upon applying voltage pulses
Kim DK, Hwang SJ
Thin Solid Films, 520(18), 6020, 2012 |
| 5 |
Thermal stationarity criteria for a proper study on growth (dissolution) kinetics in systems with small volumes of solutions in melts
Gershanov VY, Garmashov SI, Matyushina LI
Journal of Crystal Growth, 312(20), 2993, 2010 |
| 6 |
Lattice Strain Due to an Atomic Vacancy
Li SD, Sellers MS, Basaran C, Schultz AJ, Kofke DA
International Journal of Molecular Sciences, 10(6), 2798, 2009 |
| 7 |
Electromigration induced metal dissolution in flip-chip solder joints
Lin YH, Tsai CM, Hu YC, Lin YL, Tsai JY, Kao CR
Materials Science Forum, 475-479, 2655, 2005 |
