| 1 |
Exploring equivalence of information from dielectric and calorimetric measurements of thermoset cure-a model for the relationship between curing temperature, degree of cure and electrical impedance
Kazilas MC, Partridge IK
Polymer, 46(16), 5868, 2005 |
| 2 |
Kinetic analysis of a fast reacting thermoset system
Prime RB, Michalski C, Neag CM
Thermochimica Acta, 429(2), 213, 2005 |
| 3 |
Relation between mobility factor and diffusion factor for thermoset cure
Meng Y, Simon SL
Thermochimica Acta, 437(1-2), 179, 2005 |
| 4 |
In situ monitoring of reaction-induced phase separation with modulated temperature DSC: comparison between high-T-g and low-T-g modifiers
Swier S, Van Mele B
Polymer, 44(9), 2689, 2003 |
| 5 |
Influence of cure via network structure on mechanical properties of a free-radical polymerizing thermoset
Ganglani M, Carr SH, Torkelson JM
Polymer, 43(9), 2747, 2002 |
| 6 |
Interrelations between mechanism, kinetics, and rheology in an isothermal cross-linking chain-growth copolymerisation
Van Assche G, Verdonck E, Van Mele B
Polymer, 42(7), 2959, 2001 |
| 7 |
Effective adhesive modulus approach for evaluation of curing stresses
Macon DJ
Polymer, 42(12), 5285, 2001 |
| 8 |
An investigation of vinyl-ester - Styrene bulk copolymerization cure kinetics using Fourier transform infrared spectroscopy
Brill RP, Palmese GR
Journal of Applied Polymer Science, 76(10), 1572, 2000 |
| 9 |
Epoxy-diamine thermoset/thermoplastic blends: Dielectric properties before, during, and after phase separation
Bonnet A, Pascault JP, Sautereau H, Rogozinski J, Kranbuehl D
Macromolecules, 33(10), 3833, 2000 |
| 10 |
Diffusion and reaction of epoxy and amine in polysulfone studied using Fourier transform infrared spectroscopy: experimental results
Rajagopalan G, Immordino KM, Gillespie JW, McKnight SH
Polymer, 41(7), 2591, 2000 |
