검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Thermal characterization of overmolded underfill materials for stacked chip scale packages He Y Thermochimica Acta, 433(1-2), 98, 2005 |
| 2 |
Syntheses and characterizations of thermally degradable epoxy resins. III Li HY, Wang LJ, Jacob K, Wong CP Journal of Polymer Science Part A: Polymer Chemistry, 40(11), 1796, 2002 |