| 1 |
Three-dimensional atomic force microscopy for ultra-high-aspect-ratio imaging
Akhtar I, Rehman MA, Choi W, Kumar S, Lee N, Cho SJ, Park HH, Park KH, Seo Y
Applied Surface Science, 469, 582, 2019 |
| 2 |
Copper(II) oxide powder manufacture for via-filling plating from H2O2 type etching wastes
Lee SB, Jung RY, Kim SH
Journal of Industrial and Engineering Chemistry, 79, 418, 2019 |
| 3 |
Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board
Chu JH, Joo SJ, Kim HS
Thin Solid Films, 680, 1, 2019 |
| 4 |
Laser induced activation of circuit lines and via-holes on AlN for electroless metal plating
Yung KC, Chen C, Lee CP
Applied Surface Science, 257(15), 6601, 2011 |
| 5 |
Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: Low cost fabrication of circuits on a flexible substrate at room temperature
Cheng K, Yang MH, Chiu WWW, Huang CY, Chang J, Ying TF, Yang Y
Macromolecular Rapid Communications, 26(4), 247, 2005 |
| 6 |
Vertical chip of GaN-based blue light-emitting diode
Kim SJ
Solid-State Electronics, 49(7), 1153, 2005 |
