735 - 736 |
Preface to the Special Issue on Disbonding Technologies for Adhesive Bonded Joints Hutchinson AR, Sato C |
737 - 755 |
Overview of disbonding technologies for adhesive bonded joints Hutchinson A, Liu Y, Lu Y |
756 - 770 |
Debonding on command of multi-material adhesive joints Banea MD, da Silva LFM, Carbas RJC, de Barros S |
771 - 790 |
Expansion characteristics of thermally expandable microcapsules for dismantlable adhesive under hydrostatic pressure or in resin Uratani Y, Sekiguchi Y, Sato C |
791 - 810 |
The use of expandable graphite as a disbonding agent in structural adhesive joints Pausan N, Liu Y, Lu Y, Hutchinson AR |
811 - 822 |
Dismantlable adhesion properties of reactive acrylic copolymers resulting from cross-linking and gas evolution Sato E, Iki S, Yamanishi K, Horibe H, Matsumoto A |
823 - 830 |
Reworkable adhesives composed of photoresponsive azobenzene polymer for glass substrates Akiyama H, Fukata T, Yamashita A, Yoshida M, Kihara H |
831 - 854 |
Influence of adhesion area, applied voltage, and adherend materials on residual strength of joints bonded with electrically dismantlable adhesive Shiote H, Sekiguchi Y, Ohe M, Sato C |