| 1 - 18 |
Stress analysis of adhesive lap joints of dissimilar hollow shafts subjected to an axial load
Nakano Y, Kawawaki M, Sawa T |
| 19 - 28 |
Effect of a Ti interlayer on the bond strength and thermal stability of the Cu/benzocyclobutene-divinyl tetramethyldisiloxane interface
Shieu FS, Shiao MH |
| 29 - 46 |
Evaluation of the adhesion strength in DLC film-coated systems using the film-cracking technique
Jeong JH, Kwon D |
| 47 - 58 |
Surface chemistry of polyethylene grafted with hydrophilic monomers: XPS and ToF-SIMS studies
Pleul D, Schneider S, Simon F, Jacobasch HJ |
| 59 - 69 |
Rubber-to-steel bonding studies using a rubber compound strip adhesive system
John N, Joseph R |
| 71 - 94 |
Rate dependence of the peel force in peel-apart imaging films
Kogan L, Hui CY, Kramer EJ, Wallace E |
| 95 - 104 |
Tantalum, tantalum nitride, and chromium adhesion to polyimide: effect of annealing ambient on adhesion
Buchwalter LP, Holloway K |
| 105 - 119 |
Development of a surface-treatment method for AlN substrates to improve adhesion with thick-film conductors
Kuromitsu Y, Nagase T, Yoshida H, Morinaga K |
